Chemical Composition
| Grade | Copper Content (%) | Description |
| C11000 | 99.9% | Electrolytic Tough Pitch (ETP) copper |
| C10200 | 99.95% | Oxygen-free copper |
| C10100 | 99.99% | High-purity, oxygen-free high-conductivity (OFHC) copper |
Physical & Mechanical Properties
| Property | Typical Value |
| Density | 8.96 g/cm³ |
| Melting Point | 1083°C (1981°F) |
| Electrical Conductivity | 97–100% IACS |
| Tensile Strength | 200–400 MPa (varies by temper/thickness) |
| Elongation | 10–45% |
| Thickness Range | 5 μm to 200 μm (0.005 mm to 0.2 mm) |
| Width Range | 10 mm to 1300 mm |
| Surface Finish | Matte, shiny, double-shiny, treated |
Based on Production Method
Rolled Annealed (RA) Copper Foil
- Produced by rolling and annealing
- Superior flexibility, ductility
- Used in flexible circuits
Electro-Deposited (ED) Copper Foil
- Produced via electrolysis on rotating drum cathodes
- High strength, less flexible
- Common in rigid PCBs
Based on Surface Treatment
- Treated: Roughened surface for better adhesion (used in PCBs)
- Untreated: Smooth on one or both sides
- Single–sided shiny / matte / rough
- Double–sided shiny / matter
Applications
| Industry | Application Examples |
| Electronics | Printed circuit boards (PCBs), EMI shielding |
| Batteries | Lithium-ion battery current collectors |
| Aerospace | Shielding, flexible electronics |
| Automotive | EV batteries, connectors |
| Telecom | RF shielding, flexible antennas |
| Art & Crafts | Decorative foil, embossing, sculpture, etching |
| Architecture | Laminate, insulation, cladding |
Surface Types & Textures
- Shiny Surface: Higher reflectivity, smoother adhesion
- Matte Surface: Better for adhesives and soldering
- Textured/Treated Surface: Used in multilayer PCBs to increase adhesion
Common Thicknesses
| Thickness (μm) | Thickness (mm) | Common Use |
| 5 μm | 0.005 mm | Microelectronics, ultra-thin devices |
| 9 μm | 0.009 mm | High-density PCBs |
| 18 μm | 0.018 mm | Standard PCBs |
| 35 μm | 0.035 mm | Power circuits, general electronics |
| 70–105 μm | 0.07–0.105 mm | High-current circuits, batteries |
Packaging & Formats
- Rolls (most common)
- Sheets
- Custom die–cut shapes
- Usually packed with anti-oxidation wrapping or desiccants
Advantages of Copper Foil
- Excellent electrical and thermal conductivity
- High corrosion resistance
- Easy to fabricate, solder, laminate
- Compatible with surface treatments
- Recyclable and eco-friendly
Key Standards
| Standard Body | Code / Description |
| IPC | IPC-4562 (metal foil for PCBs) |
| ASTM | B534 (spec for copper foil) |
| JIS | JIS C 5051 (Japanese standard for copper foil) |
| ISO | ISO 6863 (electro-deposited copper foil for PCBs) |
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